technical data
product name
chemical structure
absorbance wavelength
features
applications
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thm208-1

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high reactivity, suitable for both free radical and cationic curing, low viscosity
electronic material packaging and ink
thm202
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high reactivity, suitable for both free radical and cationic curing
electronic material packaging and special adhesives
tcm241
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low viscosity, low volume shrinkage, good flexibility, excellent yellowing resistance, excellent physical and chemical performance
3d printing and outdoor materials
tcm218
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high reactivity, excellent flexibility
electronic material packaging and special adhesives
tcm203
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high reactivity, good chemical resistance and excellent physical strength
electronic material packaging and special adhesives
tcm201
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high reactivity, large cross-linking density
electronic material packaging and special adhesives
tcm109
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high reactivity, balanced flexibility and rigidity
electronic material packaging and special adhesives